This paper describes the packaging impacts of forecast advances in automotive electronics in two significant areas: In particular, the thermal and EMC issues resulting from these advances are discussed, and practical, cost effective, automotive relevant, solutions are proposed. To illustrate these issues in a realistic situation, a prototype implementation of a network vehicle controller has been developed.


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    Titel :

    Packaging for Next Generation Automotive Electronics


    Weitere Titelangaben:

    Sae Technical Papers


    Beteiligte:
    Nisbet, M. (Autor:in) / Miller, P. (Autor:in)

    Kongress:

    SAE 2004 World Congress & Exhibition ; 2004



    Erscheinungsdatum :

    2004-03-08




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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