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    Titel :

    Packaging for Next Generation Automotive Electronics



    Kongress:

    Sessions, Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC); Software/hardware systems, systems engineering, advanced electronics packaging, and electromagnetic compatibility (EMC)



    Erscheinungsdatum :

    2004-01-01


    Format / Umfang :

    8 pages


    Anmerkungen:

    Held as part of the SAE 2004 world congress



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Packaging for next generation automotive electronics

    Miller,P. / Nisbet,M. / Ricardo Consulting,GB | Kraftfahrwesen | 2004


    Packaging for Next Generation Automotive Electronics

    Nisbet, M. / Miller, P. | SAE Technical Papers | 2004


    Packaqing for Next Generation Automotive Electronics

    Miller, P. / Nisbet, M. / Society of Automotive Engineers | British Library Conference Proceedings | 2004


    Advanced packaging technologies for automotive electronics

    Sham, Man-Lung / Gao, Ziyang / Leung, L.L.W. et al. | Tema Archiv | 2007


    Automotive electronics - Packaging as enabler technology

    Knoblauch, Andreas | Tema Archiv | 2010