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    Title :

    Packaging for next generation automotive electronics


    Additional title:

    Das Packaging der Kraftfahrzeugelektronik der naechsten Generation.


    Contributors:

    Publication date :

    2004


    Size :

    7 pages


    Remarks:

    SAE-Paper;2004-01-1683;2004;Software/Hardware Systems, Systems Engineering...;SAE Spec.Publ.; SP-1857


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English



    Packaging for Next Generation Automotive Electronics

    Miller, P. / Nisbet, M. / Society of Automotive Engineers | British Library Conference Proceedings | 2004


    Packaging for Next Generation Automotive Electronics

    Nisbet, M. / Miller, P. | SAE Technical Papers | 2004


    Packaqing for Next Generation Automotive Electronics

    Miller, P. / Nisbet, M. / Society of Automotive Engineers | British Library Conference Proceedings | 2004


    Advanced packaging technologies for automotive electronics

    Sham, Man-Lung / Gao, Ziyang / Leung, L.L.W. et al. | Tema Archive | 2007


    Automotive electronics - Packaging as enabler technology

    Knoblauch, Andreas | Tema Archive | 2010