Semiconductors made to accept precise etching after pretreatment. Combination of material destabilization and anisotropic etching permits formation of precise perpendicular-wall cavities in silicon wafers and other semiconductors. New technique extends capabilities of current micromachining technology to fabrication of submillimeter waveguide arrays and filters. Pre-etching process currently used to fabricate thin-walled arrays of submillimeter waveguides for use as dichroic bandpass filters. Possible applications include integration of sensor probes and processing of circuitry on same silicon chip.


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    Title :

    Deep, Precise Etching in Semiconductors


    Contributors:

    Published in:

    Publication date :

    1987-03-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English




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