First generation packaging technology based on hermetic MCM-C technology is well established for LED based fiber-optic links onboard commercial jet, military jet, military helicopter, and space platforms. However, the lack of packaging commonality between the various first generation platforms has resulted in high cost optoelectronic modules. Next generation requirements will challenge packaging engineers to meet higher performance requirements, including high density array based modules, at a price and productization schedule that meets program requirements.


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    Title :

    Status of optoelectronic module packaging for avionics/aerospace applications


    Contributors:
    Beranek, M.W. (author) / Chan, E.Y. (author) / Hager, H.E. (author) / Le, Q.N. (author)


    Publication date :

    1998-01-01


    Size :

    236039 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    Status of Optoelectronics Module Packaging for Avionics/Aerospace Applications

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