The proposed modular avionics packaging scheme includes a range of digital, bus structured modules together with interface and power supply modules. The rack assembly is likely to be a complete Faraday cage structure providing the first line environmental protection against electromagnetic hazard (EMH), moisture and fluids but only offering minimal protection against the basic mechanical environment. Conducted EMH protection would be incorporated within the rack which should, ideally, allow for backplane removal through the front cover aperture. Input, output and power supply connectors should only be positioned at the ends of the rack such that the front cover can provide the maximum protection for the 'active' modules. Each module within the avionics fit is likely to incorporate one or more card assemblies manufactured with surface mount technology (SMT) components on both sides of a centrally mounted connector and heatsink rib.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Title :

    Packaging requirements (avionics)


    Additional title:

    Forderungen an Elektronikgehäuse in der Avionik


    Contributors:


    Publication date :

    1990


    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English