In considering Modular Avionics Packaging, the objective of the General Electric study program was to develop an avionics equipment packaging concept, compatible with MIL-E-5400, and applicable to multiplatform avionics requirements stretching into the 1990's. Specific elements evaluated were: Standard Avionics Module (SAM) requirements and concepts; integrated racks and WRA requirements and concepts; and airframe interface considerations. The V/STOL Type A platform was used as the driving requirement in performing trade-off studies. Key design objectives and constraints included the following: Minimizing installed avionics weight and volume; Mechanical simplicity; Significant improvement in Reliability and Maintainability; Eliminating single-point failure modes; Direct access to Weapons Replaceable Modules (WRM); Modules capable of being conduction-cooled; Significant improvement in thermal performance; and Improved testability at all hardware levels.


    Access

    Access via TIB

    Check availability in my library


    Export, share and cite



    Modular avionics packaging standardization

    AUSTIN, M. / MCNICHOLS, J. | AIAA | 1984



    SEM Packaging of Advanced Modular Avionics

    Marquart, B. / Nerius, K. / IEEE et al. | British Library Conference Proceedings | 1995


    Integrated modular avionics packaging and interfaces

    Airlines Electronic Engineering Committee / Aeronautical Radio, Inc., Annapolis, Md. | TIBKAT | 1994