In considering Modular Avionics Packaging, the objective of the General Electric study program was to develop an avionics equipment packaging concept, compatible with MIL-E-5400, and applicable to multiplatform avionics requirements stretching into the 1990's. Specific elements evaluated were: Standard Avionics Module (SAM) requirements and concepts; integrated racks and WRA requirements and concepts; and airframe interface considerations. The V/STOL Type A platform was used as the driving requirement in performing trade-off studies. Key design objectives and constraints included the following: Minimizing installed avionics weight and volume; Mechanical simplicity; Significant improvement in Reliability and Maintainability; Eliminating single-point failure modes; Direct access to Weapons Replaceable Modules (WRM); Modules capable of being conduction-cooled; Significant improvement in thermal performance; and Improved testability at all hardware levels.
Modular Avionics Packaging (MAP)
1977
341 pages
Report
No indication
English
Avionics , Standardization , Modular construction , Electronic equipment , Aircraft equipment , Vertical takeoff aircraft , Short takeoff aircraft , Maintainability , Reliability , Airborne , MAP(Modular Avionics Packaging) , Modular avionics packaging , SAM(Standard Avionics Module) , Standard avionics module , Military specifications , Modules , Packaging
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