A new flip chip bonder for very high accuracy assembly of optoelectronic devices is described. Attention will be focussed on mechanical and thermal design and performance issues, with bonding results from a laser diode device.


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    Title :

    Flip chip bonders for high end optoelectronic modules


    Contributors:


    Publication date :

    1998-01-01


    Size :

    156596 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



    Flip Chip Bonders for High End Opto-Electronic Modules

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1998




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