Soft defects in integrated circuits (ICs) are defined as failures when the IC is partially functional, but will not operate properly under all specified conditions - these conditions may be within or outside normal limits. To address soft defects, a laser scanning methodology termed soft defect localization (SDL) was developed that rapidly locates soft defects in integrated circuits. The SDL method evaluates the pass/fail state of a device in response to localized laser heating to successfully localize soft defects. The method operates globally by scanning the laser over the entire die to quickly isolate soft defects in a matter of minutes. The SDL imaging system and methodology will be described followed by the presentation of several examples.


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    Title :

    Soft defect localization (SDL) in integrated circuits using laser scanning microscopy


    Contributors:
    Bruce, M.R. (author) / Bruce, V.J. (author) / Eppes, D.H. (author) / Wilcox, J. (author) / Cole, E.I. (author) / Tangyunyong, P. (author) / Hawkins, C.F. (author) / Ring, R. (author)


    Publication date :

    2003-01-01


    Size :

    243364 byte





    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English




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