We propose a contactless characterization approach for evaluating semiconductor devices and integrated circuits that operate in the THz regime (0.1–3 THz). The non-contact probe consists of on-chip receiving and transmitting THz antennas in a co-planar waveguide environment. Commercially available frequency extension modules with horn antennas are used in conjunction with microwave vector network analyzers to excite the proposed non-contact probe. A hemispherical lens couples the signals into device under test using the on-chip antennas. We discuss the calibration process and present the numerical evaluation of two non-contact probe schemes.
Non-contact THz probes for on-chip device and IC characterization
2012-07-01
844085 byte
Conference paper
Electronic Resource
English
| TIBKAT | 1989
Contact-resistance test probes: A concept
| NTRS | 1971
Contact device for power semiconductor chip and power electronics module
| European Patent Office | 2024
Emerald Group Publishing | 1992