We propose a contactless characterization approach for evaluating semiconductor devices and integrated circuits that operate in the THz regime (0.1–3 THz). The non-contact probe consists of on-chip receiving and transmitting THz antennas in a co-planar waveguide environment. Commercially available frequency extension modules with horn antennas are used in conjunction with microwave vector network analyzers to excite the proposed non-contact probe. A hemispherical lens couples the signals into device under test using the on-chip antennas. We discuss the calibration process and present the numerical evaluation of two non-contact probe schemes.
Non-contact THz probes for on-chip device and IC characterization
01.07.2012
872294 byte
Aufsatz (Konferenz)
Elektronische Ressource
Englisch
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