A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device has: an input terminal; a wiring portion that includes a first end portion, and a second end portion, and extends in one direction, the first end portion being connected to the input terminal; a circuit substrate that includes a top surface, and a bottom surface, the top surface being provided with a first circuit board and a second circuit board along the one direction, the bottom surface being arranged on a top surface of the cooling device; a metal body connected between the wiring portion, and a top surface of the first circuit board; and a semiconductor chip that includes a top surface electrode, and a bottom surface electrode, the top surface electrode being connected to the second end portion, the bottom surface electrode being connected to a top surface of the second circuit board.


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    Title :

    SEMICONDUCTOR MODULE AND VEHICLE


    Contributors:

    Publication date :

    2020-05-07


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H02K Dynamoelektrische Maschinen , DYNAMO-ELECTRIC MACHINES / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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