A base plate (1) includes a fixed surface and a radiating surface which is a surface opposite to the fixed surface. An insulating substrate (3) is bonded to the fixed surface of the base plate (1). Conductive patterns (4,5) are provided on the insulating substrate (3). Semiconductor chips (7,8) are bonded to the conductive pattern (4). An Al wire (12) connects top surfaces of the semiconductor chip (8) to the conductive pattern (5). The insulating substrate (3), the conductive patterns (4 ,5), the semiconductor chips (7 to 10) and the Al wires (11 to 13) are sealed with resin (16). The base plate (1) includes a metal part (19) and a reinforcing member (20) provided in the metal part (19). A Young's modulus of the reinforcing member (20) is higher than a Youngs modulus of the metal part (19).


    Access

    Download


    Export, share and cite



    Title :

    SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE


    Contributors:

    Publication date :

    2016-04-21


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    B60L PROPULSION OF ELECTRICALLY-PROPELLED VEHICLES , Antrieb von elektrisch angetriebenen Fahrzeugen / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES



    Semiconductor module, semiconductor device, and vehicle

    KAWASE TATSUYA / MIYAMOTO NOBORU / ISHIHARA MIKIO et al. | European Patent Office | 2022

    Free access

    SEMICONDUCTOR MODULE AND VEHICLE

    ARAI NOBUHIDE | European Patent Office | 2020

    Free access

    SEMICONDUCTOR DEVICE, SEMICONDUCTOR MODULE, RELAY UNIT, BATTERY UNIT, AND VEHICLE

    MIURA MINEO / HAYASHIGUCHI MASASHI / TERADA JUN | European Patent Office | 2020

    Free access

    COOLING DEVICE, SEMICONDUCTOR MODULE AND VEHICLE

    ARAI NOBUHIDE | European Patent Office | 2019

    Free access

    COOLING DEVICE, SEMICONDUCTOR MODULE, AND VEHICLE

    ARAI NOBUHIDE | European Patent Office | 2019

    Free access