A semiconductor module includes a semiconductor device, and a cooling device. The semiconductor device has: an input terminal; a wiring portion that includes a first end portion, and a second end portion, and extends in one direction, the first end portion being connected to the input terminal; a circuit substrate that includes a top surface, and a bottom surface, the top surface being provided with a first circuit board and a second circuit board along the one direction, the bottom surface being arranged on a top surface of the cooling device; a metal body connected between the wiring portion, and a top surface of the first circuit board; and a semiconductor chip that includes a top surface electrode, and a bottom surface electrode, the top surface electrode being connected to the second end portion, the bottom surface electrode being connected to a top surface of the second circuit board.
SEMICONDUCTOR MODULE AND VEHICLE
2020-05-07
Patent
Elektronische Ressource
Englisch
Semiconductor module, semiconductor device, and vehicle
Europäisches Patentamt | 2022
|SEMICONDUCTOR MODULE, SEMICONDUCTOR DEVICE, AND VEHICLE
Europäisches Patentamt | 2016
|