A power semiconductor module including a cooling apparatus and a power semiconductor device mounted on the cooling apparatus, wherein the cooling apparatus includes: a ceiling plate that; a case; and a cooling fin, a ceiling plate and the case respectively include fastening portions that are used to fasten the ceiling plate and the case to an external apparatus, while the ceiling plate and the outer edge portion are arranged in an overlapping manner, the power semiconductor device includes a circuit substrate and a terminal case, the fastening portions protrude farther outward than a periphery of the ceiling plate, and the terminal case includes a case body arranged along a perimeter of the circuit substrate and reinforcing portions that extend to top surface sides of the fastening portions.
Power semiconductor module and vehicle
2021-10-26
Patent
Elektronische Ressource
Englisch
Power semiconductor module for a motor vehicle and motor vehicle
Europäisches Patentamt | 2019
|Europäisches Patentamt | 2018
|Europäisches Patentamt | 2018
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