봉지용 수지 조성물은, 배선 기판과, 상기 배선 기판 상에 탑재된 복수의 전자 부품과, 상기 전자 부품을 봉지하는 봉지 수지를 구비하는 차재용 전자 제어 유닛의 상기 봉지 수지를 형성하기 위하여 이용되는 봉지용 수지 조성물로서, 열경화성 수지와, 이미다졸류를 포함하고, 라보 플라스토밀을 이용하여 회전수 30rpm, 측정 온도 175℃의 조건으로 토크값을 경시적으로 측정했을 때에, 토크값이 최저 토크값의 2배 이하인 시간 T이 15초 이상 100초 이하이며, 최저 토크값이 0.5N·m 이상 2.5N·m 이하이다.
Provided is a resin composition for encapsulating which is used for forming an encapsulating resin of an on-vehicle electronic control unit including a wiring substrate, a plurality of electronic components mounted on the wiring substrate, and the encapsulating resin encapsulating the electronic component, the resin composition including: a thermosetting resin; and imidazoles, in which when a torque value is measured over time under conditions of the number of rotations of 30 rpm and a measurement temperature of 175°C by using Labo Plastomill, a time T 1 at which the torque value is less than or equal to 2 times a minimum torque value is longer than or equal to 15 seconds and shorter than or equal to 100 seconds, and the minimum torque value is greater than or equal to 0.5 N·m and less than or equal to 2.5 N·m.
RESIN COMPOSITION FOR SEALING METHOD FOR PRODUCING VEHICLE-MOUNTED ELECTRONIC CONTROL UNIT AND VEHICLE-MOUNTED ELECTRONIC CONTROL UNIT
봉지용 수지 조성물, 차재용 전자 제어 유닛의 제조 방법, 및 차재용 전자 제어 유닛
2017-08-02
Patent
Electronic Resource
Korean
IPC: | C08K Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe , USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS , Massen auf Basis makromolekularer Verbindungen / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES / H05K PRINTED CIRCUITS , Gedruckte Schaltungen |
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