Provided is a resin composition for encapsulating which is used for forming an encapsulating resin of an on-vehicle electronic control unit including a wiring substrate, a plurality of electronic components mounted on the wiring substrate, and the encapsulating resin encapsulating the electronic component, the resin composition including: a thermosetting resin; and imidazoles, in which when a torque value is measured over time under conditions of the number of rotations of 30 rpm and a measurement temperature of 175°C by using Labo Plastomill, a time T 1 at which the torque value is less than or equal to 2 times a minimum torque value is longer than or equal to 15 seconds and shorter than or equal to 100 seconds, and the minimum torque value is greater than or equal to 0.5 N·m and less than or equal to 2.5 N·m.


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    Title :

    RESIN COMPOSITION FOR SEALING, METHOD FOR PRODUCING VEHICLE-MOUNTED ELECTRONIC CONTROL UNIT, AND VEHICLE-MOUNTED ELECTRONIC CONTROL UNIT


    Additional title:

    HARZZUSAMMENSETZUNG ZUR VERSIEGELUNG, VERFAHREN ZUR HERSTELLUNG EINER AUF EINEM FAHRZEUG MONTIERTEN ELEKTRONISCHEN STEUEREINHEIT UND FAHRZEUGMONTIERTE ELEKTRONISCHE STEUEREINHEIT
    COMPOSITION DE RÉSINE D'ÉTANCHÉITÉ, PROCÉDÉ DE FABRICATION DE BLOC DE COMMANDE ÉLECTRONIQUE À BORD D'UN VÉHICULE ET BLOC DE COMMANDE ÉLECTRONIQUE À BORD D'UN VÉHICULE


    Contributors:

    Publication date :

    2019-12-18


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR / C08K Verwendung von anorganischen oder nichtmakromolekularen organischen Stoffen als Zusatzstoffe , USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES AS COMPOUNDING INGREDIENTS / C08L COMPOSITIONS OF MACROMOLECULAR COMPOUNDS , Massen auf Basis makromolekularer Verbindungen / H01L Halbleiterbauelemente , SEMICONDUCTOR DEVICES





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