본 발명에 따른 모듈 조립체는 차량의 헤드라이닝에 부착되고, 상부가 개방된 베이스; 상기 베이스의 내측 바닥면으로 수직 방향으로 연장되는 다수의 안착 기둥에 순차적으로 적층되고, 플렉서블 케이블에 의해 전기적으로 연결되는 제1 및 제2 인쇄회로기판; 및 상기 베이스와 조립되어, 상기 베이스 상에 적층된 상기 제1 및 제2 인쇄회로기판을 커버하는 커버를 포함한다.

    A module assembly is attached on a headlining of a vehicle and includes a base where an upper portion thereof is open, a first printed circuit board (PCB) and a second PCB sequentially stacked on a plurality of supporting pillars extending in a vertical direction to an inner bottom surface of the base and electrically connected to each other by a flexible cable, and a cover assembled with the base to cover the first and second PCBs stacked on the base.


    Access

    Download


    Export, share and cite



    Title :

    MODULAR ASSEMBLY MOUNTED TO A HEADLINING OF A VEHICLE


    Additional title:

    차량의 헤드라이닝에 장착되는 모듈 조립체


    Publication date :

    2024-01-08


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    Korean


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



    MODULAR ASSEMBLY MOUNTED TO A HEADLINING OF A VEHICLE

    WOO MYEONG NAM / SHIN UHN YONG | European Patent Office | 2021

    Free access

    Module assembly mounted on headlining of vehicle

    WOO MYEONG NAM / SHIN UHN YONG | European Patent Office | 2023

    Free access

    MODULE ASSEMBLY MOUNTED ON HEADLINING OF VEHICLE

    WOO MYEONG NAM / SHIN UHN YONG | European Patent Office | 2021

    Free access

    HEADLINING FOR VEHICLE

    KWON CHOONG HO / JEON YONG SEOK | European Patent Office | 2017

    Free access

    HEADLINING MODULE FOR VEHICLE

    KWON CHOONG HO / RYU MIN YONG | European Patent Office | 2017

    Free access