본 발명에 따른 모듈 조립체는 차량의 헤드라이닝에 부착되고, 상부가 개방된 베이스; 상기 베이스의 내측 바닥면으로 수직 방향으로 연장되는 다수의 안착 기둥에 순차적으로 적층되고, 플렉서블 케이블에 의해 전기적으로 연결되는 제1 및 제2 인쇄회로기판; 및 상기 베이스와 조립되어, 상기 베이스 상에 적층된 상기 제1 및 제2 인쇄회로기판을 커버하는 커버를 포함한다.

    A module assembly is attached on a headlining of a vehicle and includes a base where an upper portion thereof is open, a first printed circuit board (PCB) and a second PCB sequentially stacked on a plurality of supporting pillars extending in a vertical direction to an inner bottom surface of the base and electrically connected to each other by a flexible cable, and a cover assembled with the base to cover the first and second PCBs stacked on the base.


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    Titel :

    MODULAR ASSEMBLY MOUNTED TO A HEADLINING OF A VEHICLE


    Weitere Titelangaben:

    차량의 헤드라이닝에 장착되는 모듈 조립체


    Erscheinungsdatum :

    2024-01-08


    Medientyp :

    Patent


    Format :

    Elektronische Ressource


    Sprache :

    Koreanisch


    Klassifikation :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



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