A module assembly is attached on a headlining of a vehicle and includes a base where an upper portion thereof is open, a first printed circuit board (PCB) and a second PCB sequentially stacked on a plurality of supporting pillars extending in a vertical direction to an inner bottom surface of the base and electrically connected to each other by a flexible cable, and a cover assembled with the base to cover the first and second PCBs stacked on the base.


    Access

    Download


    Export, share and cite



    Title :

    MODULE ASSEMBLY MOUNTED ON HEADLINING OF VEHICLE


    Contributors:

    Publication date :

    2021-09-16


    Type of media :

    Patent


    Type of material :

    Electronic Resource


    Language :

    English


    Classification :

    IPC:    H05K PRINTED CIRCUITS , Gedruckte Schaltungen / B60R Fahrzeuge, Fahrzeugausstattung oder Fahrzeugteile, soweit nicht anderweitig vorgesehen , VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR



    Module assembly mounted on headlining of vehicle

    WOO MYEONG NAM / SHIN UHN YONG | European Patent Office | 2023

    Free access

    MODULAR ASSEMBLY MOUNTED TO A HEADLINING OF A VEHICLE

    European Patent Office | 2024

    Free access

    HEADLINING MODULE FOR VEHICLE

    KWON CHOONG HO / RYU MIN YONG | European Patent Office | 2017

    Free access

    MODULAR ASSEMBLY MOUNTED TO A HEADLINING OF A VEHICLE

    WOO MYEONG NAM / SHIN UHN YONG | European Patent Office | 2021

    Free access

    HEADLINING FOR VEHICLE

    KWON CHOONG HO / JEON YONG SEOK | European Patent Office | 2017

    Free access