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    Title :

    High power surface mount packages


    Additional title:

    SMT fuer die Leistungselektronik.


    Contributors:

    Publication date :

    1998


    Size :

    4 pages


    Remarks:

    SAE-Paper;980349;1998;Electronic Packaging;SAE Spec.Publ.; SP-1345


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English



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