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    Title :

    Multichip packages - the next stage of integration for automotive electronics?


    Additional title:

    Multichip Pakete - die naechste Integrationsstufe der Kraftfahrzeugelektronik?


    Contributors:

    Publication date :

    1991


    Size :

    5 pages


    Remarks:

    IEE Conf.Publ.(Inst.of Electrical Engineers,London);346;1991;8th Int.Conf.on Automotive Electronics


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English




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