Experimental study of an electronic module potting dispensing process
Experimentelle Untersuchung der Verteilung des Thermoplasts beim Verkapseln von elektronischen Modulen.
2008
5 pages
SAE-Paper;2008-01-0716;2008;Reliability and Robust Design in Automotive Engineering;SAE Spec.Publ.; SP-2170
Miscellaneous
English
Experimental Study of an Electronic Module Potting Dispensing Process
British Library Conference Proceedings | 2008
|Experimental Study of an Electronic Module Potting Dispensing Process
SAE Technical Papers | 2008
|2008-01-0716 Experimental Study of an Electronic Module Potting Dispensing Process
British Library Conference Proceedings | 2008
|Potting procedure for electronic components
NTRS | 1977
|