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    Title :

    Experimental study of an electronic module potting dispensing process


    Additional title:

    Experimentelle Untersuchung der Verteilung des Thermoplasts beim Verkapseln von elektronischen Modulen.



    Publication date :

    2008


    Size :

    5 pages


    Remarks:

    SAE-Paper;2008-01-0716;2008;Reliability and Robust Design in Automotive Engineering;SAE Spec.Publ.; SP-2170


    Type of media :

    Miscellaneous


    Type of material :

    Print


    Language :

    English



    Experimental Study of an Electronic Module Potting Dispensing Process

    Vinarcik, E.J. / Society of Automotive Engineers | British Library Conference Proceedings | 2008


    Experimental Study of an Electronic Module Potting Dispensing Process

    Vinarcik, Edward J. | SAE Technical Papers | 2008


    2008-01-0716 Experimental Study of an Electronic Module Potting Dispensing Process

    Vinarcik, E.J. | British Library Conference Proceedings | 2008



    Potting procedure for electronic components

    Rubino, A. G. / Zimmerman, J. | NTRS | 1977