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    Title :

    2008-01-0716 Experimental Study of an Electronic Module Potting Dispensing Process


    Contributors:

    Conference:

    Session, Reliability and robust design in automotive engineering ; 2008 ; Detroit, Mich



    Publication date :

    2008-01-01


    Size :

    6 pages


    Remarks:

    Held during the SAE 2008 world congress



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




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