Potting process is modified to effect a match more closely between embedded electronic components, potting mediums, and thermal environment. Application of room-temperature vulcanizing silicone rubber band cured in modified thermal cycle minimizes coil-to-resin adhesion and thus lowers stresses between transformer and potting compound.


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    Title :

    Potting procedure for electronic components


    Contributors:

    Published in:

    Publication date :

    1977-11-01



    Type of media :

    Miscellaneous


    Type of material :

    No indication


    Language :

    English