Potting process is modified to effect a match more closely between embedded electronic components, potting mediums, and thermal environment. Application of room-temperature vulcanizing silicone rubber band cured in modified thermal cycle minimizes coil-to-resin adhesion and thus lowers stresses between transformer and potting compound.
Potting procedure for electronic components
NASA Tech Briefs ; 2 , 3
1977-11-01
Miscellaneous
No indication
English