Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Stress analysis of stepped-lap joints with bondline flaws


    Author / Creator :

    KAN, H. P., RATWANI, M. M.


    Contributors:
    KAN, H. P. (author) / RATWANI, M. M. (author)

    Published in:

    Journal of Aircraft ; 20 , 10 ; 848-852


    Publication date :

    1983




    Type of media :

    Article (Journal)


    Type of material :

    Electronic Resource


    Language :

    English




    Cryotank skin/stringer bondline analysis

    Nguyen, Bao | Tema Archive | 1999



    Effect of Bondline Thickness on Mode I Fracture in Adhesive Joints

    Qian, H. / Sun, C. / American Institute of Aeronautics and Astronautics | British Library Conference Proceedings | 2008


    Bondline embedded current sensor

    ANWAY CAROL E / ROBB ANDREW M / IHN JEONG-BEOM | European Patent Office | 2016

    Free access