Access

    Check access

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Stress analysis of stepped lap joint with bondline flaws


    Contributors:
    KAN, H. (author) / RATWANI, M. (author)

    Conference:

    23rd Structures, Structural Dynamics and Materials Conference ; 1982 ; New Orleans , LA , U.S.A.



    Publication date :

    1982-01-01



    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English




    Stress analysis of stepped-lap joints with bondline flaws

    KAN, H. P. / RATWANI, M. M. | AIAA | 1983


    Cryotank skin/stringer bondline analysis

    Nguyen, Bao | Tema Archive | 1999



    Bondline embedded current sensor

    ANWAY CAROL E / ROBB ANDREW M / IHN JEONG-BEOM | European Patent Office | 2016

    Free access

    AN ADHESIVE BONDLINE SPACER CLIP

    SCHMIDT MARCUS / VAN DER PUTTEN ZEF | European Patent Office | 2021

    Free access