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    Title :

    Characterization of bonded wafer stacks by use of the photoelastic-analysis-method


    Contributors:
    Geiler, H. (author) / Schulz, K. (author) / Knechtel, R. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 19 , 5 ; 697-703


    Publication date :

    2013-01-01


    Size :

    7 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



    Bonded Joints - a Photoelastic Study

    V. Niranjan | NTIS | 1970


    Bonded joints a photoelastic study

    Niranjan, V. | TIBKAT | 1969


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    Photoelastic Model Analysis of Sandwich Beams

    S.K. BANSAL AND C.L. AMBA RAO | AIAA | 1973


    Photoelastic model analysis of sandwich beams.

    BANSAL, S. K. / AMBA-RAO, C. L. | AIAA | 1972