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    Title :

    Microelectronic chip cooling: an experimental assessment of a liquid-passing heat sink, a microchannel heat rejection module, and a microchannel-based recirculating-liquid cooling system


    Contributors:
    Lu, B. (author) / Meng, W. J. (author) / Mei, F. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 18 , 3 ; 341-352


    Publication date :

    2012-01-01


    Size :

    12 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



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