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    Title :

    Microchannel Heat Pipe Cooling of Modules



    Conference:

    Avionics panel symposium, Advanced packaging concepts for digital avionics ; 1994 ; San Diego; CA



    Publication date :

    1994-01-01


    Size :

    19 pages




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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