Microelectronic chip cooling: an experimental assessment of a liquid-passing heat sink, a microchannel heat rejection module, and a microchannel-based recirculating-liquid cooling system
MICROSYSTEM TECHNOLOGIES ; 18 , 3 ; 341-352
01.01.2012
12 pages
Aufsatz (Zeitschrift)
Englisch
DDC: | 629.83 |
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