Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Single-wafer die-level fusion bonding process for multi-layer devices


    Contributors:
    Dong, H. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 15 , 7 ; 981-984


    Publication date :

    2009-01-01


    Size :

    4 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



    Pick-and-place multi-wafer bonding of photonic devices on Si

    Crouse, D. / Zhu, Z. H. / Lo, Y.-H. et al. | British Library Conference Proceedings | 1998


    CMOS: compatible wafer bonding for MEMS and wafer-level 3D integration

    Dragoi, V. / Pabo, E. / Burggraf, J. r. et al. | British Library Online Contents | 2012


    Wafer fusion technology for optoelectronic devices

    Bowers, J. / Hawkins, A. / Margalit, N. et al. | IEEE | 1997


    Thin-Film Devices Fabricated With Benzocyclobutene Adhesive Wafer Bonding

    Christiaens, I. / Roelkens, G. / De Mesel, K. et al. | British Library Online Contents | 2005


    Fabricatio of nanomechanical optical devices with aligned wafer bonding

    Gui, C. / Veldhuis, G. J. / Koster, T. M. et al. | British Library Online Contents | 1999