Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Pick-and-place multi-wafer bonding of photonic devices on Si


    Contributors:

    Conference:

    Workshop, Novel solitons and nonlinear periodic structures ; 1998 ; Victoria; Canada



    Publication date :

    1998-01-01


    Size :

    IMF4



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Fabrication of Photonic Devices on Si Using Pick-and-Place Multi-Wafer Technology

    IEEE; Lasers and Electro-Optics Society | British Library Conference Proceedings | 1998


    Pick-and-place tool

    WANG PENGFEI | European Patent Office | 2023

    Free access

    Pick-and place apparatus for display panels and pick-and-place method thereof

    WANG KAI | European Patent Office | 2019

    Free access


    Single-wafer die-level fusion bonding process for multi-layer devices

    Dong, H. | British Library Online Contents | 2009