Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Study on demolding temperature in thermal imprint lithography via finite element analysis


    Contributors:
    Song, Z. (author) / You, B. H. (author) / Lee, J. (author) / Park, S. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 14 , 9-11 ; 1593-1597


    Publication date :

    2008-01-01


    Size :

    5 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83



    DEMOLDING

    FIX COURTNEY MICHELE / MURRAY ROBERT WAYNE / DIEP PAUL et al. | European Patent Office | 2022

    Free access

    DEMOLDING

    FIX COURTNEY MICHELE / MURRAY ROBERT WAYNE / DIEP PAUL et al. | European Patent Office | 2024

    Free access

    Demolding

    FIX COURTNEY MICHELE / MURRAY ROBERT WAYNE / DIEP PAUL et al. | European Patent Office | 2023

    Free access

    Ultra-Precision Alignment for Room-Temperature Multi-Layer Imprint Lithography

    Li, W. / Bingheng, L. / Dongyin, C. | British Library Online Contents | 2004


    Thermally Induced Error Analysis for the Imprint Spindle of High-Precision Imprint Lithography Tools

    Le, Y. / Bingheng, L. / Yucheng, D. | British Library Online Contents | 2004