Access

    Access via TIB

    Check availability in my library

    Order at Subito €


    Export, share and cite



    Title :

    Versatile low temperature wafer bonding and bond strength measurement by a blister test method


    Contributors:
    Doll, A. (author) / Rabold, M. (author) / Goldschmidtböing, F. (author) / Woias, P. (author)

    Published in:

    MICROSYSTEM TECHNOLOGIES ; 12 , 5 ; 418-429


    Publication date :

    2006-01-01


    Size :

    12 pages



    Type of media :

    Article (Journal)


    Type of material :

    Print


    Language :

    English


    Classification :

    DDC:    629.83




    Wafer bonding using Cu–Sn intermetallic bonding layers

    Flötgen, C. / Pawlak, M. / Pabo, E. et al. | British Library Online Contents | 2014


    Numerical and Experimental Investigation of Ice Adhesion Using the Blister Test

    Bastawros, Ashraf / Dawood, Bishoy / Giuffre, Christopher et al. | SAE Technical Papers | 2019


    Numerical and Experimental Investigation of Ice Adhesion Using the Blister Test

    Giuffre, Christopher / Dawood, Bishoy / Yavas, Denizhan et al. | British Library Conference Proceedings | 2019


    Blister packaging box carrying device

    YAO SHAOJUN | European Patent Office | 2024

    Free access