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    Title :

    A Discussion on the Methods of Thermal Cycling and Power Cycling for Reliability Prediction of Solder Joints of Electronic Components



    Conference:

    24th SAE Brasil International Congress and Display



    Publication date :

    2015-01-01


    Size :

    ALL-ALL



    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English



    A Discussion on the Methods of Thermal Cycling and Power Cycling for Reliability Prediction of Solder Joints of Electronic Components

    de Brito, Alirio Cavalcanti / de Oliveira e Souza, Marcelo Lopes | SAE Technical Papers | 2015



    Observation of Chip Solder Degradation by Electrical Measurements during Power Cycling

    Hartmann, S. / Bayer, M. / Schneider, D. et al. | British Library Conference Proceedings | 2010



    Prognostics modeling of solder joints in electronic components

    Simons, J.W. / Shockey, D.A. | IEEE | 2006