Crack Propagation in Solder Joints During Thermal-Mechanical Cycling
1993-11-28
Preprint
No indication
English
British Library Conference Proceedings | 2015
|Fatigue crack propagation and strain cycling properties.
NTRS | 1969
|Behaviour of lead-free solder joints under thermal and mechanical stresses
Tema Archive | 2000
|NTRS | 1976
|