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    Titel :

    A Discussion on the Methods of Thermal Cycling and Power Cycling for Reliability Prediction of Solder Joints of Electronic Components



    Kongress:

    24th SAE Brasil International Congress and Display



    Erscheinungsdatum :

    01.01.2015


    Format / Umfang :

    ALL-ALL



    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch



    A Discussion on the Methods of Thermal Cycling and Power Cycling for Reliability Prediction of Solder Joints of Electronic Components

    de Brito, Alirio Cavalcanti / de Oliveira e Souza, Marcelo Lopes | SAE Technical Papers | 2015



    Observation of Chip Solder Degradation by Electrical Measurements during Power Cycling

    Hartmann, S. / Bayer, M. / Schneider, D. et al. | British Library Conference Proceedings | 2010



    Prognostics modeling of solder joints in electronic components

    Simons, J.W. / Shockey, D.A. | IEEE | 2006