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    Titel :

    Observation of Chip Solder Degradation by Electrical Measurements during Power Cycling



    Kongress:

    6th, International conference on integrated power electronics systems; CIPS 2010 ; 2010 ; Nuremberg, Germany



    Erscheinungsdatum :

    2010-01-01


    Format / Umfang :

    6 pages


    Anmerkungen:

    Also held on CD-ROM. Held in Cage




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch





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