Thermal cycling of electronic assemblies produces repeated mechanical loading of interconnecting joints through differential thermal expansion among assembly members. The phenomena that control mechanisms limiting the thermal cycling reliability of electronic assemblies are discussed. The combination of stresses produced by thick film metallization, microstructure, thermal expansion mismatch between the motherboard and the assembled component, in conjunction with diffusion of solder species, dominant deformation mechanisms and the brittle nature of the ceramic substrate; contribute to the observed failure mechanisms. The failure mechanism is usually manifested by reduction in thermal cycling adhesion and/or joint/substrate cracking for solder interconnections and increased junction resistance for conductive adhesive joints. Based on the above study, metallization schemes and package designs are recommended for enhanced thermal cycling reliability to meet the automotive under the hood requirements.


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    Titel :

    Thermal cycling reliability of electronic interconnections for automotive 'under-the-hood' applications


    Weitere Titelangaben:

    Temperaturwechselbeständigkeit elektronischer Verbindungen für den Einsatz unter den Motorhauben von Autos


    Beteiligte:
    Keusseyan, R.L. (Autor:in) / Dilday, J.L. (Autor:in)


    Erscheinungsdatum :

    1993


    Format / Umfang :

    7 Seiten, 10 Bilder, 16 Quellen


    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




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