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    Title :

    Low Thermal Resistance Flip-Chip Bonding of 850 nm 2-D VCSEL Arrays Capable of 10 Gbit/s/ch Operation


    Contributors:

    Conference:

    Annual meeting; 16th, IEEE Lasers & Electro-optics Society; LEOS 2003 ; 2003 ; Tucson, AZ



    Publication date :

    2003-01-01


    Size :

    2 pages


    Remarks:

    IEEE cat. no. 03CH37460




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English





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