Summary form only given. We have demonstrated an 8x8 VCSEL array flip-chip bonded to a dummy silicon chip that mimics the real CMOS driver IC by using Al metal lines and contact pads. All the bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. This demonstrates the suitability of this bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs.
Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links
1998-01-01
256788 byte
Conference paper
Electronic Resource
English
Flip-Chip Bonding of VCSEL Arrays with Silicon Driver Chips for High Speed Data Links
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