Summary form only given. We have demonstrated an 8x8 VCSEL array flip-chip bonded to a dummy silicon chip that mimics the real CMOS driver IC by using Al metal lines and contact pads. All the bonded devices operated reliably, showing only a small variation in wavelength, threshold current and power output across the array. This demonstrates the suitability of this bonding technique for the integration of VCSEL arrays with high speed Si-based CMOS driver ICs.


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    Title :

    Flip-chip bonding of VCSEL arrays with silicon driver chips for high speed data links


    Contributors:
    Koelle, U. (author) / Johnson, S.R. (author) / Kelkar, P. (author) / Turpin, R. (author) / Dowd, P. (author) / Pan, G. (author) / Zhang, Y.-H. (author)


    Publication date :

    1998-01-01


    Size :

    256788 byte




    Type of media :

    Conference paper


    Type of material :

    Electronic Resource


    Language :

    English



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