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    Title :

    Modeling VCSEL characteristics using device and package models [2691-22]



    Conference:

    Conference, Optoelectronic packaging ; 1996 ; San Jose; CA



    Publication date :

    1996-01-01


    Size :

    12 pages




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Coupling of VCSEL array into multimode polymer waveguides [2691-05]

    Rowlette, J. R. / Kallen, M. K. / Lewis, W. H. et al. | British Library Conference Proceedings | 1996


    Nr. 2691

    DataCite | 1897



    Thermal shift in the exciton absorption maxima as a function of the chip package design [2691-20]

    Buchholz, D. B. / Lentine, A. L. / Novotny, R. A. et al. | British Library Conference Proceedings | 1996


    Micromachined silicon structures for single-mode passive alignment [2691-15]

    Han, H. / Schramm, J. E. / Mathews, J. et al. | British Library Conference Proceedings | 1996