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    Title :

    Thermal shift in the exciton absorption maxima as a function of the chip package design [2691-20]



    Conference:

    Conference, Optoelectronic packaging ; 1996 ; San Jose; CA



    Publication date :

    1996-01-01


    Size :

    9 pages




    Type of media :

    Conference paper


    Type of material :

    Print


    Language :

    English




    Nr. 2691

    DataCite | 1897


    Modeling VCSEL characteristics using device and package models [2691-22]

    Morozova, N. D. / Lee, Y.-C. / SPIE | British Library Conference Proceedings | 1996


    Fluxless Sn-Ag solder ball formation for flip-chip application [2691-08]

    Flachsbart, B. R. / Hsieh, K.-C. / SPIE | British Library Conference Proceedings | 1996


    Optomechanical design of a robust free-space optical switching system [2691-11]

    Reiley, D. J. / Sasian, J. M. / Beckman, M. G. et al. | British Library Conference Proceedings | 1996


    Thermal resistance of etched-pillar vertical-cavity surface-emitting laser diodes [2691-21]

    Wipiejewski, T. / Peters, M. G. / Young, D. B. et al. | British Library Conference Proceedings | 1996