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Scaling of temperature sensors for smart power MOSFETs
Die neue Vernetzung zwischen Automobilherstellern und ihren Zulieferern
Commercial-Components Initiative: Ground Benign Systems-plastic encapsulated microcircuits
A comparison of Si CMOS and SiGe BiCMOS technologies for automotive radars
Automotive electronics: designing custom ICs for a harsh environment
Microelectronics for space applications - challenges and opportunities
Random vibration screening of an airborne digital computer
In situ screening techniques for defective oxides in devices for automotive applications
Rad-hard ASIC for photodetector signal processing
A case study of IC storage failures in Taipei trains
6H-SiC transistor integrated circuits demonstrating prolonged operation at 500 deg C
EMC-aware design on a microcontroller for automotive applications
QML (qualified manufacturing line): a method of providing high quality integrated circuits
Programmable Aging Sensor for Automotive Safety-Critical Applications
Interfaces and error management trades for solid state recorders
Eine neue Fehlertoleranzmethode zur Verringerung des Flächenaufwandes von TMR-Systemen
Dispersion and the worst case of thermal fatigue life of solder joints in vehicle electronic devices
Intelligent control for vibration reduction and falling-forward prevention of forklift
Mechanical considerations for reliable interfaces in next generation electronics packaging
SRAM based re-programmable FPGA for space applications
In-depth characterization of die attach adhesive for low-k automotive device application
New on-chip screening of gate oxides smart power devices for automotive applications
Risk mitigation for the development of the new Ariane 5 on-board computer
Reliability of MEMS - a methodical approach
Zuverlaessigkeit am Beispiel der Flugzeugelektronik
Trends in failure survival techniques for avionic systems
A new methodology for SEE testing and simulations
Electric Vehicles and the Environment
0.1 mu m InGaAs/InAlAs/InP HEMT MMICs - a flight qualified technology
ICAs for automotive applications in higher temperature ranges
Off-line quality control via yield constrained variability minimization in circuit design
A performance measure for a VHSIC avionic system: mission dependent availability
Reliable power electronics for automotive applications
Effect of post-mold curing of epoxy molding compound on wirebond reliability in a MOSFET
Multilayer alumina substrates for ECU (automotive electronics)