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Wirebonding on multilayer circuits for automotive applications using robust thick-film conductors
Widely tunable laser technologies: meeting the needs of tomorrow's networks [4652-31]
Wideband channelized receiver possibilities with 0.18 micron CMOS technology
Welding-induced alignment distortion in DIP LD packages: effect of laser welding sequence [4652-15]
W-band monolithic single sideband transceiver for automotive radar applications
Vying for Value: A Supplier's Perspective on the Competitive Advantage of Value Engineering
VLSI microphotonics: issues, challenges, and prospects (Invited Paper) [4652-01]
Virtual simulator for mobile robots navigation systems
Vibration-induced fatigue failures in bonding wires used in stacked chip modules
Vibration control of a wing box via reciprocal state space framework
VHSIC phase 2 technology and the EHF modem/controller
VHDL-AMS design for flight control systems
Vehicle Testing for Electromagnetic Compatibility
Vehicle instrument displays - The electronic revolution
Vehicle instrument displays - the electronic revolution
Validation Test Plan for AS4074 Linear Token Passing Multiplex Data Bus
Validation Test Plan for AS4074 Linear Token Passing Multiplex Data Bus
UV-visible sensors based on polymorphous silicon
UV-laser-based process for quantum well intermixing of III-V heterostructures [5451-86]
Utilizing off-the-shelf parts for the next generation of space exploration
Using test data to predict avionics integrity
Use of glass solder in fixing an optical fiber in a laser package [4652-17]
Use of checkout equipment for scientific satellite testing
Universal microcomputer electrical testing system II (UNIMETS II)
Trough-shaft contactless magnetic sensor with a stroke up to 360 degrees
Trench j-MOS power field-effect transistors
Transient thermal impedance considerations in power semiconductor applications
Tolerance of polarization-independent waveguides for communication devices [5451-55]
Through wafer via hole by reactive ion etching of GaAs [4652-14]
Third-order nonlinearities of sulfur and selenide glasses at telecommunication wavelengths [5451-52]
The use of VHSIC/VLSIC gate array in improving military digital electronic hardware
The status of automotive electronics in Europe
The solid state remote power controller: its status, use and perspective
The role of CAE/CAD in the avionics integrity program (AVIP)
Thermo-optic switches using sol-gel-processed hybrid materials [5451-82]
Thermal packaging of piggyback VCSELs for GBd optical communications modules [4290-23]