Through wafer via hole by reactive ion etching of GaAs [4652-14]
Conference; 4th, Photonic packaging and integration; Optoelectronic interconnects, integrated circuits and packaging ; 2002 ; San Jose, CA
Photonic packaging and integration; Optoelectronic interconnects, integrated circuits and packaging ; 120-127
2002-01-01
8 pages
Aufsatz (Konferenz)
Englisch
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DataCite | 1934
Cantilever microscanners for free-space optical interconnects [4652-26]
British Library Conference Proceedings | 2002
|Telecommunication fiber OPA analysis, project, and characterization [4652-23]
British Library Conference Proceedings | 2002
|Optical assembly of collimator arrays for MEMS applications [4652-21]
British Library Conference Proceedings | 2002
|Emerging technologies for chip-level optical interconnects [4652-25]
British Library Conference Proceedings | 2002
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