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    Titel :

    Through wafer via hole by reactive ion etching of GaAs [4652-14]



    Kongress:

    Conference; 4th, Photonic packaging and integration; Optoelectronic interconnects, integrated circuits and packaging ; 2002 ; San Jose, CA



    Erscheinungsdatum :

    2002-01-01


    Format / Umfang :

    8 pages




    Medientyp :

    Aufsatz (Konferenz)


    Format :

    Print


    Sprache :

    Englisch




    Nr. 4652

    DataCite | 1934


    Cantilever microscanners for free-space optical interconnects [4652-26]

    Xu, B. / Tokranova, N. / Castracane, J. et al. | British Library Conference Proceedings | 2002


    Telecommunication fiber OPA analysis, project, and characterization [4652-23]

    Marazzi, L. / Parolari, P. / Toscani, I. et al. | British Library Conference Proceedings | 2002


    Optical assembly of collimator arrays for MEMS applications [4652-21]

    Zhang, N. / Vodhanel, F. / Hagenbuechle, M. et al. | British Library Conference Proceedings | 2002


    Emerging technologies for chip-level optical interconnects [4652-25]

    Oktyabrsky, S. / Castracane, J. / Kaloyeros, A. et al. | British Library Conference Proceedings | 2002