Optical assembly of collimator arrays for MEMS applications [4652-21]
Conference; 4th, Photonic packaging and integration; Optoelectronic interconnects, integrated circuits and packaging ; 2002 ; San Jose, CA
Photonic packaging and integration; Optoelectronic interconnects, integrated circuits and packaging ; 171-176
2002-01-01
6 pages
Aufsatz (Konferenz)
Englisch
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DataCite | 1934
Cantilever microscanners for free-space optical interconnects [4652-26]
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|Emerging technologies for chip-level optical interconnects [4652-25]
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|AIAA-2001-4652 Characteristics of Hermetic 6H-SiC MEMS Pressure Sensors at 600 C
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|Hybrid-integrated optical isolators and circulators (Invited Paper) [4652-08]
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