The author conducts a brief survey of TRW very-high-speed integrated circuits (VHSIC) Phase 2 technology and then explores its potential benefits along with its limitations to an EHF modem/controller. The impact of TRW VHSIC Phase 2 SuperChips is analyzed for the overall command-post and manpack modem/controller requirements, hardware architecture, data/control flow and mechanical design. It is found that the use of TRW VHSIC Phase 2 chips results in an order-of-magnitude improvement of size, weight, power, and reliability over conventional technology. Design areas which potentially limit the impact of high levels of integration are also discussed, along with their solutions.
VHSIC phase 2 technology and the EHF modem/controller
Die Technologie der VHSIC Phase 2 und der Modem/Controller fuer Millimeterwellen
1988
Aufsatz (Konferenz)
Englisch
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