Advances in IC technology have fueled a rapid increase in the functional density of electronic equipment. Along with this has come a higher probability of product failures caused by thermal, structural, and humidity overstressing. Most of these problems can be overcome by the proper utilization of CAE/CAD analysis software products. The author addresses these issues and discusses how design tools can help new projects meet avionics integrity program requirements.
The role of CAE/CAD in the avionics integrity program (AVIP)
Die Rolle von CAE/CAD im Avionik-Vollstaendigkeitsprogramm
Ninth Annual IEEE/AESS ; 49-54
1988
6 Seiten
Aufsatz (Konferenz)
Englisch
The Avionics Integrity Program
SAE Technical Papers | 1988
|Avionics integrity program : Papers
TIBKAT | 1988
|Avionics/electronics integrity program (AVIP) highlights
Tema Archiv | 1988
|R&M through avionics/electronics integrity program
Tema Archiv | 1989
|Implementing an avionics integrity program-a case study
Tema Archiv | 1990
|